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Featured role

San Diego, USA$200K–$350K
Featured roleSan Diego, USA$200K–$350K

Application Engineer at Global semiconductor packaging manufacturer

Are you a bilingual packaging expert ready to lead a major market expansion? We are seeking an Application Engineer to be the first technical face in North America for a $2B global leader in IC substrates. You will bridge the gap between world-class R&D and the world's largest chipmakers, driving NPI and qualification for cutting-edge technologies like FC-BGA and chiplets. With a total compensation range of $200K-$350K and the autonomy to build a local presence from scratch, this is a rare opportunity to combine deep engineering with high-level strategic impact.

Overview

Why this role stands out

You will serve as the primary technical bridge between major North American chipmakers and overseas R&D teams. As the first local technical hire, you will lead design-in, qualification, and mass production activities for advanced IC substrate products. This role combines deep technical expertise in packaging with strategic customer-facing impact during a major market expansion.

Company

About the company

Global semiconductor packaging manufacturer

Responsibilities

What you will do

  • Serve as the primary technical interface between North American customers and international engineering teams to drive product qualification.
  • Analyze and resolve complex technical issues related to substrate design, materials, process yield, and reliability for mass production.
  • Lead technical presentations and coordinate data exchange to ensure customer requirements for advanced packaging (FC-BGA, SiP) are met.

Candidate profile

Who this is a fit for

  • 5+ years of experience in IC packaging, substrates, or semiconductor assembly and test with a strong technical degree.
  • Fully bilingual in English and Mandarin with the ability to lead deep technical discussions across diverse global stakeholders.
  • Deep knowledge of advanced technologies like flip chip, chiplets, and 2.5D/3D packaging within an OSAT or foundry environment.

What makes it remarkable

Why this role is remarkable

  • Strategic autonomy as the first technical hire on the ground for a multi-billion dollar global industry leader.
  • High visibility working directly with top-tier North American semiconductor firms on next-generation packaging technologies.
  • Massive growth potential within a well-established company aggressively expanding its footprint in the advanced substrate market.

Jack & Jill

How Jack & Jill work together

Jack
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Jill
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About Jack & Jill

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