You will serve as the primary technical bridge between major North American chipmakers and overseas R&D teams. As the first local technical hire, you will lead design-in, qualification, and mass production activities for advanced IC substrate products. This role combines deep technical expertise in packaging with strategic customer-facing impact during a major market expansion.
Application Engineer at Global semiconductor packaging manufacturer
Are you a bilingual packaging expert ready to lead a major market expansion? We are seeking an Application Engineer to be the first technical face in North America for a $2B global leader in IC substrates. You will bridge the gap between world-class R&D and the world's largest chipmakers, driving NPI and qualification for cutting-edge technologies like FC-BGA and chiplets. With a total compensation range of $200K-$350K and the autonomy to build a local presence from scratch, this is a rare opportunity to combine deep engineering with high-level strategic impact.
Overview
Why this role stands out
Company
About the company
Global semiconductor packaging manufacturer
Responsibilities
What you will do
- Serve as the primary technical interface between North American customers and international engineering teams to drive product qualification.
- Analyze and resolve complex technical issues related to substrate design, materials, process yield, and reliability for mass production.
- Lead technical presentations and coordinate data exchange to ensure customer requirements for advanced packaging (FC-BGA, SiP) are met.
Candidate profile
Who this is a fit for
- 5+ years of experience in IC packaging, substrates, or semiconductor assembly and test with a strong technical degree.
- Fully bilingual in English and Mandarin with the ability to lead deep technical discussions across diverse global stakeholders.
- Deep knowledge of advanced technologies like flip chip, chiplets, and 2.5D/3D packaging within an OSAT or foundry environment.
What makes it remarkable
Why this role is remarkable
- Strategic autonomy as the first technical hire on the ground for a multi-billion dollar global industry leader.
- High visibility working directly with top-tier North American semiconductor firms on next-generation packaging technologies.
- Massive growth potential within a well-established company aggressively expanding its footprint in the advanced substrate market.
Jack & Jill
How Jack & Jill work together
About Jack & Jill
Meet Jack
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How does this work?
Jack's an AI agent for job searching and career coaching. He works for you.
Jill is the AI recruiter working for the company. She recruits from Jack's network.
If it's a match and the company wants to meet you, they'll make the intro. In the meantime, if you'd like, Jack will send you excellent alternatives.